SOIC-to-JEDEC TO Adapter
FEATURES * 8-position SOIC footprint on the top and a circular, 8-pin JEDEC TO male pin footprint on the bottom. IC now available only in 8-position SOIC packages, can be readily mounted on boards having JEDEC TO thru-hole footprints without having to redesign the board. * Consult factory for mounting of consigned chips. GENERAL SPECIFICATIONS * ADAPTER BOARD: FR-4, 0.062 [1.58] thick, with 1-oz. Cu traces both sides * MALE PIN: Brass 360 1/2-hard per UNS C36000, ASTM B16/B16M * MALE PIN PLATING: 200 [5.08] Sn/Pb 93/7 ASTM B579-73 over 100 [2.54] Ni per SAE-AMS-QQ-N-290 * OPERATING TEMPERATURE: 221F [105C] MOUNTING CONSIDERATIONS
* SUGGESTED PCB HOLE SIZE: 0.028 0.003 [0.71 0.08] dia.
ALL DIMENSIONS: INCHES [MILLIMETERS] ALL TOLERANCES: 0.005 [0.13] UNLESS OTHERWISE SPECIFIED DIP-to-TO ADAPTER ALSO AVAILABLE. CONSULT DATA SHEET 18012 CONSULT FACTORY FOR OTHER SIZES AND CONFIGURATIONS
CUSTOMIZATION: In addition to the standard products shown on this page, Aries specializes in custom design and production. Special materials, platings, sizes, and configurations can be furnished, depending on the quantity. NOTE: Aries reserves the right to change product general specifications without notice.
ORDERING INFORMATION
P/N 1109814 08-301296-10 08-305479-10 Dim "C" 0.200[5.08] 0.300[7.62] 0.270[6.85]
Bristol, PA 19007-6810 USA TEL (215) 781-9956 * FAX (215) 781-9845 WWW.ARIESELEC.COM * INFO@ARIESELEC.COM
PRINTOUTS OF THIS DOCUMENT MAY BE OUT OF DATE AND SHOULD BE CONSIDERED UNCONTROLLED
18013 Rev. AA
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